Euresys Grablink DualBase

Euresys grablink dualbase frame grabber top front view

Dual-Channel Power for Demanding Camera Link Systems

The Euresys Grablink DualBase delivers high-performance, dual-base Camera Link acquisition designed for advanced machine vision applications requiring greater flexibility and throughput.

With support for two simultaneous Base-configuration cameras, it enables scalable imaging setups, higher inspection speeds, and efficient multi-camera workflows. Its robust, low-latency architecture ensures stable operation even under continuous, high-duty cycles.

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Graphic of products moving on a conveyor with a camera mounted above, connected to a computer and a monitor displaying live data stream

Engineered for Precision, Synchronization, and System Efficiency

Featuring hardware-assisted synchronization, advanced triggering, and powerful DMA transfers, the Grablink DualBase maximizes the performance of multi-camera systems while offloading the host CPU.

Comprehensive digital I/O, encoder support, and precise timing controls streamline integration into complex inspection, robotics, or motion-controlled environments. Backed by Euresys' reliable driver ecosystem and GenICam-compliant tools, it offers long-term stability for industrial and scientific imaging tasks.

Grablink DualBase Key Features:

Supports two independent Base-configuration Camera Link cameras
Simultaneous, low-latency acquisition with hardware triggering
High-efficiency DMA data transfers to minimize CPU load
Extensive digital I/O and encoder support for advanced synchronization
Full SDK and driver support, including GenICam-compliant configuration

Euresys grablink dualbase frame grabber front view

Ideal Solution For:

Multi-camera industrial inspection systems
Robotics and synchronized imaging setups
Electronics and semiconductor inspection
High-speed packaging, printing, and surface inspection
Scientific imaging and laboratory systems requiring dual-camera acquisition

Technical Specifications

Specification	Grablink DualBase
Mechanical
Form Factor	PCI Express Card
Format	Standard profile, half length, 4-lane PCI Express card
Cooling	Air-cooling, fanless
Mounting	For insertion in a standard height, 4-lane or higher, PCI Express card slot
Connectors	'A' on bracket: 26-pos SDR socket, CameraLink Camera A 'B' on bracket: 26-pos SDR socket, CameraLink Camera B 'External I/O' on standard bracket: 26-pin 3-row high-density female sub-D connector, I/O lines and power output 'Internal I/O' A on PCB: 26-pin 2-row 0.1" pitch pin header with shrouding, I/O lines of Camera A and power output 'Internal I/O' B on PCB: 26-pin 2-row 0.1" pitch pin header with shrouding, I/O lines of Camera B and power output 'Power Input' on module: 4-pin MOLEX power socket, 12 VDC power input for PoCL camera and I/O power
Dimensions	PCB L X H: 167.65 mm x 111.15 mm, 6.6 in x 4.38 in
Weight	142 g
Host Bus
Standard	PCI Express 1.0
Link Width	4 lanes
Link Speed	2.5 GT/s (PCIe 1.0)
Max Payload Size	1024 bytes
DMA	32- and 64-bit
Peak Delivery Bandwidth	1,024 MB/s
Power Consumption	Max.7.2 W; Typ. 6.0 W (0.47 A @ 3.3V, 0.37 A @+12V)
Camera/Video Inputs
Camera Interface Standard	Camera Link 2.0
Max Link Speed	85 MHz
Max Link Width	24-bit (BASE)
Camera Power	PoCL
Connectors	Two Shrunk Delta Ribbon (SDR) Miniature Camera Link (MiniCL)
Number of Cameras	2 Base or Lite cameras
Line-scan Supported	Yes
Max Aggregated Camera Data Transfer Rate	4.08 Gbps (510 MB/s)
CL Configuration	Base or Lite
Camera Link Clock Frequency	From 20 MHz up to 85 MHz
PoCL	Two independent PoCL SafePower compliant controllers with overload, over-voltage and short-circuit protection
Camera Types	Grayscale and colour (RGB and Bayer) area- and line-scan cameras
On-board Processing
On-Board Memory	128 MB (64 MB for image data)
Image Data Stream Processing	Unpacking of 10-/12-/14-bit to 16-bit with selectable justification to LSb or MSb
Input LUT	Monochrome: 8-bit, 10-bit or 12-bit per pixel, up to 500 MPixel/s per camera RGB: 3x8-bit per pixel, up to 125 MPixel/s per camera
Bayer CFA to RGB decoder	Advanced interpolation method using average and median functions on a 3x3 kernel Up to 125 MPixel/s per camera
General Purpose Inputs/Outputs
Number of Lines	2 sets of 10 I/O lines, each set including: 2 differential inputs (DIN) 4 isolated inputs (IIN) 4 isolated outputs (IOUT)
Electrical Specifications	DIN: High-speed differential inputs, up to 5 MHz IIN: Isolated current-sense inputs with wide voltage input range up to 30V, compatible with totem-pole LVTTL, TTL, 5V CMOS drivers, RS-422 differential line drivers, potential free contacts, solid-state relays and opto-couplers IOUT: Isolated contact outputs compatible with 30V / 100mA loads NOTE: IIN and IOUT lines provide a functional isolation grade for the circuit technical protection. It does not provide an isolation that can protect a human being from electrical shock.
Filter Control	Glitch removal filter available only on input lines used as trigger sources. Configurable with five time constants.
Power Output	Non-isolated, +5V, 1A and +12V, 1A, with electronic fuse protection
Software
Driver	MultiCam
Host PC OS	Microsoft Windows 11, 10, 8.1, 7 , including the Server and the IoT Enterprise versions, for x86 (32-bit) and x86-64 (64-bit) processor architectures Linux for x86 (32-bit) and x86-64 (64-bit) processor architectures
APIs	MultiCam 32- and 64-bit binary libraries (Windows and Linux), for ISO-compliant C/C++ compilers
Momento Supported	Yes