ImageIR 8100 Key Benefits:
- HighSense measurement stabilization for consistent accuracy across varying conditions
- Snapshot image acquisition with flexible readout modes (ITR/IWR)
- Compact, lightweight design ideal for system integration and OEM solutions
- Interchangeable lenses to tailor field of view for diverse measurement tasks
- Cost-effective, compact optical design with high imaging quality
- GigE Vision and SDK support for seamless control and automation integration
Ideal Solution For:
- High-temperature industrial processes such as hot forming, forging, and heat treatment
- Metal industry measurement including welding, brazing, and press hardening
- Additive manufacturing and laser process monitoring
- Ceramics and glass production quality control
- Automated inspection systems in production and process control
- Research & development environments requiring precise, repeatable thermal data.
Technical Specifications
Specification |
ImageIR 8100 |
| Spectral Range | 0.9 - 1.7 µm |
| Pixel Pitch | 5 µm |
| Detector | InGaAs |
| Detector Format | 640 x 512 pixels |
| Image Recording Principle | Snapshot |
| Readout Mode | ITR/IWR |
| Aperture Ratio | F/2.2 or F/3.0 |
| Temperature Measurement Range | 300 - 850°C, up to 1,700°C |
| Measurement Accuracy | +/-1% |
| Temperature Resolution at 30°C | Better than1 K (Temp resolution at 350 to 1,000°C) |
| Frame Rate (Full/Half/Quarter/Sub) | Up to 237 / 445 / 793 / 2,958 Hz |
| Window Mode | Yes |
| Focus | Manual |
| Dynamic Range | Up to 12 bit |
| Integration Time | 21 - 20,000 µs, visual up to 10 s |
| Picture Synchronization | External Trigger |
| Interfaces | GigE Vision |
| Protection level | IP40 |
| Dimensions, Weight | 78 x 55 x 55 mm; 350 g (without lens) |